Bitmain was granted a patent for a thermally managed server.

{
  "signal_id": "7d3eddec-4d4e-56e3-96c6-95a47d9d29cf",
  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-09-30T17:45:34+00:00",
  "company": {
    "name": "Bitmain",
    "domain": "bitmain.com"
  },
  "data": {
    "cpc": [
      {
        "code": "H05K 7/20727",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "G06F 1/206",
        "label": "Electric digital data processing"
      },
      {
        "code": "H05K 7/20436",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "H05K 7/20172",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      }
    ],
    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Data Center",
      "Servers",
      "Engineering"
    ],
    "detail": "In September 2026 Bitmain patented a server cooling design for electronics-intensive computing systems, helping move heat away from circuit boards during operation.",
    "summary": "Bitmain was granted a patent for a thermally managed server.",
    "event_at": "2026-09-29",
    "inventors": [
      {
        "name": "Ketuan Zhan",
        "status": "unresolved",
        "is_primary": true
      },
      {
        "name": "Yang Li",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Hongbo Zeng",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Jinbao Zhang",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Mingliang Hao",
        "status": "unresolved",
        "is_primary": false
      }
    ],
    "tech_area": "PCB / electronics packaging",
    "event_kind": "grant_date",
    "grant_date": "2026-09-29",
    "source_url": "https://patents.google.com/patent/US12750980",
    "cpc_primary": {
      "code": "H05K 7/20727",
      "label": "Printed circuits; casings; manufacture of electrical assemblages"
    },
    "patent_title": "Server",
    "patent_number": "US12750980",
    "uspto_assignee": "BITMAIN TECHNOLOGIES INC.",
    "patent_abstract": "Provided is a server ( 100 ), which is applicable to the technical field of electronic devices. The server ( 100 ) includes a server main body ( 110 ), a power supply ( 120 ), and a heat conduction layer ( 130 ), where the server main body ( 110 ) includes a chassis ( 111 ), a first circuit board assembly ( 112 ), and a heat dissipation fan assembly ( 113 ); the first circuit board assembly ( 112 ) is installed in the chassis ( 111 ); and the heat dissipation fan assembly ( 113 ) is installed on the chassis ( 111 ) to dissipate heat of the first circuit board assembly ( 112 ). The power supply ( 120 ) is installed on one side of the chassis ( 111 ); and the heat conduction layer ( 130 ) is arranged between the power supply ( 120 ) and the chassis ( 111 ) to conduct heat generated by the power supply ( 120 ) to the chassis ( 111 ).",
    "precision_class": "structural",
    "invention_explanation": "A server chassis that combines a power supply, circuit-board assembly, fans, and a heat-conducting layer to carry heat away and improve cooling.",
    "technologies_mentioned": [
      "server hardware",
      "thermal management",
      "circuit boards",
      "cooling fans"
    ]
  }
}

curl https://signals.autobound.ai/v1/signals/7d3eddec-4d4e-56e3-96c6-95a47d9d29cf \
  -H "X-API-KEY: $AUTOBOUND_API_KEY"

curl -X POST https://signals.autobound.ai/v1/companies/enrich \
  -H "X-API-KEY: $AUTOBOUND_API_KEY" \
  -H "Content-Type: application/json" \
  -d '{"domain":"bitmain.com","limit":20}'