Intel unveils photonics roadmap
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Intel laid out its silicon photonics technology blueprint at the OCP 2026 conference, positioning the technology as the core architecture for next-generation high-performance computing and AI data centres. Nic Dubé, Intel's VP of data centre systems and solutions, described silicon photonics as a "golden hammer" and claimed Intel is the only foundry in the industry capable of volume production on 300mm InP wafers. Intel said its integrated laser design uses a highly reliable light source requiring no additional maintenance, while also supporting industry standards for external light sources; preserving design flexibility across different system architectures and providing the industry with a US foundry supply source for multi-wavelength light sources. Intel uses near-packaged optics (NPO) and co-packaged optics (CPO) to push optical components as close as possible to compute chips and network switch chips, shortening the transmission path for high-speed electrical signals and easing the signal attenuation and power burden of copper wiring in high-speed, long-distance scenarios. Intel's stated energy target is to reduce the transmission energy of optical interconnect systems to under 5 picojoules per transmitted bit (5pJ/bit). For data centre operators, if optical interconnects can push energy per transmitted bit below 5pJ/bit, it would directly affect the power allocation...
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