Lightmatter and Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure
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Lightmatter and Cadence collaborate to accelerate optical interconnect for AI infrastructure. Technical collaboration leverages Cadence AI/HPC IP in next-generation optical engines for hyperscale AI data centers MOUNTAIN VIEW, Calif. - (BUSINESS WIRE) - Lightmatter, the leader in photonic (super)computing, today announced a technical collaboration with Cadence to develop co-packaged optics (CPO) solutions that integrate Cadence's silicon-proven, high-speed SerDes IP with Lightmatter's Passage(TM) optical engine. By focusing on integration with advanced-node CMOS technology and industry-standard packaging workflows, the collaboration aims to pave the way for high-performance, manufacturing-ready CPO in next-generation AI and high-performance computing (HPC) environments. The transition to CPO represents a major inflection point for AI infrastructure, moving beyond traditional pluggables and near-packaged optics to fully integrated, 2D and 3D-stacked photonic interconnects. The combination of Cadence's optics-optimized high-speed SerDes, Universal Chiplet Interconnect Express(TM)(UCIe(TM) IP for disaggregation, and EDA expertise with Lightmatter's silicon photonics and laser leadership establishes a roadmap of silicon-proven technologies for the development of hyperscalers' custom AI infrastructure chips. "The next big leap in AI performance requires a fundamental change...
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