Lightmatter collaborates with Qualcomm to launch AI optical interconnect solutions.
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Lightmatter collaborates with Qualcomm to launch AI optical interconnect solutions. Silicon photonics has become a prominent field in the AI era. Photonic computing startup Lightmatter announced three new advancements in AI optical interconnect: achieving a milestone of 1.6Tbps transmission per fiber in collaboration with Qualcomm, launching a detachable Fiber Array Unit (FAU) suitable for Co-Packaged Optics (CPO), and introducing the Passage L20 universal optical engine supporting Near-Package Optics (NPO) and On-Board Optics (OBO). Lightmatter's new product releases indicate that the company is expanding from the most advanced 3D CPO outward to more easily adoptable rack-level and board-level optical interconnect solutions, broadening its layout in next-generation AI data center infrastructure. Among these, the most notable achievement is Lightmatter's successful sampling of the Passage CPO chiplet after integrating with Qualcomm's 112G PAM4 optical SerDes chiplet, achieving 1.6Tbps throughput per fiber through a 16-wavelength DWDM architecture. Lightmatter stated that this platform can increase bandwidth density per fiber by up to 8 times compared to existing NPO and CPO solutions, paving the way for the Passage L-Series toward I/O exceeding 100Tbps per package. Related Evaluation Kits have been provided to leading customers for testing. For mass production...
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