Lightmatter teams up with Qualcomm to advance AI optical interconnect, achieving 1.6Tbps transmission per fiber.
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Lightmatter teams up with Qualcomm to advance AI optical interconnect, achieving 1.6Tbps transmission per fiber. * March 12, 2026 * 16:16 * Industrial and Commercial Times, Li Juanping Photonics computing company Lightmatter announced that its Passage Co-Packaged Optics (CPO) chiplet has been successfully sampled, achieving a single-fiber throughput of 1.6Tbps. It utilizes a 16-wavelength DWDM architecture, with each SerDes channel operating at 112G, and integrates Qualcomm Technologies' 112G PAM4 optical SerDes chiplet. Lightmatter stated that this platform offers up to 8 times higher bandwidth density per fiber compared to existing NPO and CPO solutions, moving towards I/O exceeding 100Tbps per package. Related products have already been provided to leading customers for testing and will be showcased at OFC 2026 in Los Angeles from March 15 to 19.
