NVIDIA was granted a patent for hybrid cooling in computing modules.

{
  "signal_id": "07fc2090-11c6-548b-863a-6e91e0a59b48",
  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-10-21T16:26:59+00:00",
  "company": {
    "name": "Nvidia",
    "domain": "nvidia.com"
  },
  "data": {
    "cpc": [
      {
        "code": "H05K 7/20272",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "G06F 1/20",
        "label": "Electric digital data processing"
      }
    ],
    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Engineering",
      "Data Center"
    ],
    "detail": "In October 2026 NVIDIA patented thermal-management hardware for electronics and computing systems, helping cool components that operate at different temperatures.",
    "summary": "NVIDIA was granted a patent for hybrid cooling in computing modules.",
    "event_at": "2026-10-20",
    "inventors": [
      {
        "name": "Tahir Cader",
        "status": "resolved",
        "is_primary": true,
        "linkedin_url": "https://www.linkedin.com/in/tahir-cader-1a0263122"
      },
      {
        "name": "David Copeland",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/davidcopelanddreng"
      },
      {
        "name": "Elad Mentovich",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/elad-mentovich-a463b916"
      }
    ],
    "tech_area": "PCB / electronics packaging",
    "event_kind": "grant_date",
    "grant_date": "2026-10-20",
    "source_url": "https://patents.google.com/patent/US12772413",
    "cpc_primary": {
      "code": "H05K 7/20272",
      "label": "Printed circuits; casings; manufacture of electrical assemblages"
    },
    "patent_title": "Computing modules with hybrid thermal management",
    "patent_number": "US12772413",
    "uspto_assignee": "NVIDIA Corporation",
    "patent_abstract": "Devices, apparatuses, systems, and methods are provided for hybrid thermal management in computing modules. An example computing module includes a first computing component having a first operating temperature and a second computing component having a second operating temperature. The first operating temperature is greater than the second operating temperature. The example computing module further includes a hybrid thermal management system including a cooling delivery device configured to receive a cooling fluid. The cooling delivery device defines a first section configured to dissipate heat generated by the first computing component and a second section configured to dissipate heat generated by the second computing component. The first section of the cooling delivery device may be fluidically isolated from the second section of the cooling delivery device or the second section may be in fluid communication with the first section.",
    "precision_class": "structural",
    "invention_explanation": "A cooling system that directs different kinds or amounts of cooling to separate computing parts based on how hot each one runs.",
    "technologies_mentioned": [
      "thermal management",
      "electronics packaging",
      "computing modules"
    ]
  }
}

curl https://signals.autobound.ai/v1/signals/07fc2090-11c6-548b-863a-6e91e0a59b48 \
  -H "X-API-KEY: $AUTOBOUND_API_KEY"

curl -X POST https://signals.autobound.ai/v1/companies/enrich \
  -H "X-API-KEY: $AUTOBOUND_API_KEY" \
  -H "Content-Type: application/json" \
  -d '{"domain":"nvidia.com","limit":20}'