Qnity launches Optivision Max CMP pads for advanced chip manufacturing.
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Qnity launches Optivision Max CMP pads for advanced chip manufacturing. Qnity Electronics, Inc. has introduced its Optivision Max CMP pad family, expanding its chemical mechanical planarization (CMP) portfolio aimed at supporting advanced semiconductor manufacturing processes. The company said the new polishing pads are designed to address growing complexity in chip fabrication as device geometries shrink and architectures become more intricate. CMP processes are increasingly critical in ensuring surface precision and uniformity across semiconductor wafers. Optivision Max is positioned as a next-generation soft polishing pad developed to improve defect control, extend pad lifetime, and enhance overall process efficiency. The company said these improvements are intended to support higher yields and more stable manufacturing performance. Sanjay Kotha, Vice President and General Manager of CMP Technologies at Qnity Electronics, said advanced semiconductor nodes are placing new demands on manufacturing precision. He said the Optivision(TM) Max platform reflects ongoing efforts to strengthen CMP solutions for next-generation device requirements. The CMP pad family builds on Qnity's existing Optivision product line. It is designed to offer greater control over critical polishing steps, particularly in advanced nodes where process variation can significantly impact device...
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