DuPont Electronics was granted a patent for ultrathin, high-strength copper foil.

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  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-09-15T19:29:49+00:00",
  "company": {
    "name": "Qnity Electronics",
    "domain": "qnityelectronics.com"
  },
  "data": {
    "cpc": [
      {
        "code": "C25D 5/48"
      },
      {
        "code": "C25D 3/38"
      },
      {
        "code": "C25D 5/04"
      },
      {
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        "label": "Batteries / electrochemical direct conversion of chemical to electrical energy"
      }
    ],
    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Engineering",
      "Manufacturing Operations"
    ],
    "detail": "In August 2026 DuPont Electronics patented lightweight copper foil for use in electronic components and other products requiring thin, durable conductive materials.",
    "summary": "DuPont Electronics was granted a patent for ultrathin, high-strength copper foil.",
    "event_at": "2026-08-25",
    "inventors": [
      {
        "name": "Shih-Ching Lin",
        "status": "unresolved",
        "is_primary": true
      },
      {
        "name": "Ya-Mei Lin",
        "status": "unresolved",
        "is_primary": false
      }
    ],
    "event_kind": "grant_date",
    "grant_date": "2026-08-25",
    "source_url": "https://patents.google.com/patent/US12716144",
    "cpc_primary": {
      "code": "C25D 5/48"
    },
    "patent_title": "Ultrathin copper foil, a method for manufacturing the same, and an article made therefrom",
    "patent_number": "US12716144",
    "uspto_assignee": "DUPONT ELECTRONICS, INC.",
    "patent_abstract": "The present invention discloses an ultrathin copper foil without a carrier, that has an area weight of about 45 g/m 2 or less; a nominal thickness of about 5.0 μm or less; a tensile strength of about 40 Kgf/mm 2 or more; and a loop stiffness of 2 mN or more. Also disclosed are methods for manufacturing the present ultrathin copper foils, surface-treated ultrathin copper foils and articles made therefrom.",
    "precision_class": "structural",
    "invention_explanation": "A carrier-free copper sheet only a few micrometers thick that stays strong and stiff enough to be handled and built into finished articles.",
    "technologies_mentioned": [
      "copper foil",
      "electroplating",
      "electronic materials"
    ]
  }
}

curl https://signals.autobound.ai/v1/signals/d3bdddf7-2187-56f6-a8c7-4b4c58f5f10c \
  -H "X-API-KEY: $AUTOBOUND_API_KEY"

curl -X POST https://signals.autobound.ai/v1/companies/enrich \
  -H "X-API-KEY: $AUTOBOUND_API_KEY" \
  -H "Content-Type: application/json" \
  -d '{"domain":"qnityelectronics.com","limit":20}'