Synopsys and TSMC Partner to Accelerate AI Systems Innovation with Agentic AI and Advanced Design
Article excerpt
Highlighted: the sentence this signal was extracted from
New collaborations span A14 design enablement, AI-assisted engineering workflows, CoWoS® support for multi-die designs, and unified multiphysics signoff SUNNYVALE, Calif., Sept. 23, 2026 /PRNewswire/ -- Synopsys (Nasdaq: SNPS ) today announced new innovations with TSMC that accelerate the development of next-generation AI, high-performance computing (HPC), and advanced semiconductor systems. Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complexity while accelerating adoption of TSMC's latest process and advanced packaging technologies. "As AI systems continue to grow in scale and complexity, customers require proven IP, intelligent design solutions, and advanced packaging methodologies that work together seamlessly," said Michael Buehler-Garcia, Senior Vice President at Synopsys. "Our joint innovations with TSMC address the continuum of silicon to systems co-design capabilities needed to accelerate development of next-generation AI and high-performance computing systems." "Our collaboration with Open Innovation Platform® (OIP) ecosystem partners like Synopsys continues to meet the rapidly growing demands of AI and high-performance computing," said Aveek Sarkar, Director of the Ecosystem and Alliance Management...
Keep reading with a free account
The rest of this article, and every signal for Synopsys, is in your free account.
