Teradyne introduces integrated test solution for AI and data centre devices.
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Teradyne introduces integrated test solution for AI and data centre devices. Thursday 11th June 2026 Teradyne's UltraFLEXplus platform paired with Tokyo Electron's probing technology delivers known good device screening for advanced 2.5D/3D packages. Teradyne has introduced an integrated test cell solution supporting known good device (KGD) screening for devices used in AI and data center applications, developed in collaboration with Tokyo Electron. The solution pairs Teradyne's UltraFLEXplus platform with TEL's Prexa(TM) SDP (Singulated Device Prober) to provide fabless designers, foundries, and OSATs a production-ready path to high-quality device screening at multiple points in the advanced packaging flow. As AI and data center device architectures increasingly adopt chiplet-based designs that integrate multiple die into a single 2.5D or 3D package, a single defective die can compromise the entire high-value package. Adding KGD screening is essential to protecting final yield, improving quality, and maximizing output. The joint solution between Teradyne and TEL delivers a validated test cell designed to reduce integration risk for high-volume manufacturing. Within the test cell, Teradyne's UltraFLEXplus instruments coordinate with TEL's Prexa SDP, which maintains device temperature and manages the high-power dissipation characteristics typical of leading-edge AI...
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