Wolfspeed was granted a patent for a flip-chip transistor layout

{
  "signal_id": "0c62039c-dc40-5068-9163-45ab17605de9",
  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-09-30T17:46:42+00:00",
  "company": {
    "name": "Wolfspeed",
    "domain": "wolfspeed.com"
  },
  "data": {
    "cpc": [
      {
        "code": "H10D 84/82",
        "label": "Inorganic electric semiconductor devices (2025 CPC reorg of parts of H01L)"
      },
      {
        "code": "H10W 20/43"
      },
      {
        "code": "H10W 72/9445"
      },
      {
        "code": "H10W 72/227"
      },
      {
        "code": "H10W 72/232"
      }
    ],
    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Engineering",
      "Manufacturing Operations"
    ],
    "detail": "In September 2026 Wolfspeed patented a compact power-semiconductor structure for electronics that use flip-chip assembly and parallel transistor cells.",
    "summary": "Wolfspeed was granted a patent for a flip-chip transistor layout",
    "event_at": "2026-09-29",
    "inventors": [
      {
        "name": "Fabian Radulescu",
        "status": "resolved",
        "is_primary": true,
        "linkedin_url": "https://www.linkedin.com/in/fabian-radulescu-681b3b4"
      },
      {
        "name": "Basim Noori",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/basim-noori-6792767"
      },
      {
        "name": "Scott Sheppard",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Qianli Mu",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/qianlimu"
      },
      {
        "name": "Jeremy Fisher",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Dan Namishia",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/dan-namishia-75582319"
      }
    ],
    "tech_area": "semiconductors",
    "event_kind": "grant_date",
    "grant_date": "2026-09-29",
    "source_url": "https://patents.google.com/patent/US12751077",
    "cpc_primary": {
      "code": "H10D 84/82",
      "label": "Inorganic electric semiconductor devices (2025 CPC reorg of parts of H01L)"
    },
    "patent_title": "Flip-chip field effect transistor layouts and structures",
    "patent_number": "US12751077",
    "uspto_assignee": "Wolfspeed, Inc.",
    "patent_abstract": "A transistor device includes a substrate and a plurality of transistor unit cells arranged in parallel on the substrate. Each of the transistor unit cells includes a source contact, a drain contact, and a gate finger between the source contact and the drain contact. The gate finger extends in a first direction and has a first end and a second end. The transistor device further includes a first solder bump on the transistor device that is within a periphery of the active region of the device and is electrically connected to the gate finger of a first one of the unit cells at a feed point that is between the first end and the second end of the gate finger.",
    "precision_class": "structural",
    "invention_explanation": "A transistor design that places solder connections inside the active area and arranges many gate, source, and drain cells in parallel to improve chip packaging and performance.",
    "technologies_mentioned": [
      "power semiconductors",
      "flip-chip packaging",
      "field-effect transistors",
      "solder bumps"
    ]
  }
}

curl https://signals.autobound.ai/v1/signals/0c62039c-dc40-5068-9163-45ab17605de9 \
  -H "X-API-KEY: $AUTOBOUND_API_KEY"

curl -X POST https://signals.autobound.ai/v1/companies/enrich \
  -H "X-API-KEY: $AUTOBOUND_API_KEY" \
  -H "Content-Type: application/json" \
  -d '{"domain":"wolfspeed.com","limit":20}'