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Applied Materials8-K: Material contract

Applied Materials Enters Agreement to Increase Stake in BE Semiconductor Industries to ~20%

Source: Autobound Signal API · 100 signals tracked for Applied Materials · updated

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What happened

Applied Materials entered into an accelerated share purchase agreement to expand its ownership of BE Semiconductor Industries N.V. (Besi) shares to approximately 20%.

Source

SEC EDGAROct 26, 2026

Current report (Form 8-K)

Applied Materials 8-K

Filing excerpt

On October 26, 2026, Applied Materials, Inc. (“Applied”) entered into an accelerated share purchase agreement (the “Agreement”) to acquire shares of common stock of BE Semiconductor Industries N.V. (“Besi”), a Dutch public limited company.

sec.gov/Archives/edgar/data/6951/000162828026067303/amat-20261026.htmRead the full source

Extracted by Autobound

From the Signal API record
Signal
8-K: Material contract

What this signalsFilings often name leadership changes, deals and spending plans.

Form
8-K
Fiscal year end
10/26
Filed
Oct 26, 2026

The full record

From the Signal API record

Numbers

Percent
20% (ownership of Besi outstanding shares following purchase)

Details

CIK
6951
Accession number
0001628280-26-067303
Filing year
2026
Why it matters
Vendor relationship signal
Signal category
Strategic

Topics and mentions

Technologies

  • hybrid bonding
  • interconnect architectures
  • 3D IC
  • thermo-compression bonding
  • die-on-wafer
  • die-on-die
  • die-on-panel

Extraction

Confidence
High
Relevance
80%
Sentiment
Positive
Detected
Oct 27, 2026
signal_type
sec-8k
signal_subtype
materialContract

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The API returns more than this page shows

This page shows a preview. The full sec-8k record in the Signal API and MCP can also have these 8 fields. Some fields are empty for some signals.

Company

  • linkedin_urlValue in the API
  • industriesValue in the API
  • employee_count_lowValue in the API
  • employee_count_highValue in the API
  • revenueValue in the API
  • descriptionValue in the API

Signal

  • signal_nameValue in the API
  • associationValue in the API
Show the full JSONThe record on this page and the API request

GET /v1/signals/61fe9460-d6ed-4689-9cfd-5a50b70421d8 returns this record as JSON. POST /v1/companies/enrich returns every signal for appliedmaterials.com.

{
  "signal_id": "61fe9460-d6ed-4689-9cfd-5a50b70421d8",
  "signal_type": "sec-8k",
  "signal_subtype": "materialContract",
  "detected_at": "2026-10-27T08:04:03.79+00:00",
  "company": {
    "name": "Applied Materials",
    "domain": "appliedmaterials.com"
  },
  "data": {
    "detail": "Applied Materials entered into an accelerated share purchase agreement to expand its ownership of BE Semiconductor Industries N.V. (Besi) shares to approximately 20%. The expanded strategic partnership focuses on advanced packaging, hybrid bonding, and 3D IC scaling, which may signal increased collaboration and technical integration opportunities for semiconductor manufacturing vendors.",
    "metrics": {
      "pct": 0.2,
      "pct_context": "ownership of Besi outstanding shares following purchase"
    },
    "summary": "Applied Materials Enters Agreement to Increase Stake in BE Semiconductor Industries to ~20%",
    "excerpts": "On October 26, 2026, Applied Materials, Inc. (“Applied”) entered into an accelerated share purchase agreement (the “Agreement”) to acquire shares of common stock of BE Semiconductor Industries N.V. (“Besi”), a Dutch public limited company.",
    "relevance": 0.8,
    "sentiment": "positive",
    "confidence": "high",
    "source_url": "https://www.sec.gov/Archives/edgar/data/6951/000162828026067303/amat-20261026.htm",
    "filing_date": "2026-10-26",
    "filing_year": 2026,
    "fiscal_year_end": "10/26",
    "sales_relevance": "Vendor relationship signal",
    "signal_category": "strategic",
    "technologies_mentioned": [
      "hybrid bonding",
      "interconnect architectures",
      "3D IC",
      "thermo-compression bonding",
      "die-on-wafer",
      "die-on-die",
      "die-on-panel"
    ]
  }
}

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