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BitmainPatent grant

Bitmain was granted a patent for a more efficient cooling device

What happened

In September 2026 Bitmain patented a fluid-based cooling solution for managing heat in high-performance computing equipment and electronics.

Source

patents.google.comSep 29, 2026

US patent US12747917

Cooling device

Abstract

The present application provides a cooling device. The cooling device includes a first plate body and a second plate body, where a first surface of the first plate body is provided with a flow channel, the flow channel is configured to accommodate fluid, the flow channel includes at least two straight segments and at least one bent segment, the at least two straight segments are communicated via the at least one bent segment, the first surface of the first plate body is in contact with the second plate body. The cooling device of the present application has an enhanced heat dissipation performance.

patents.google.com/patent/US12747917Read the full source

Extracted by Autobound

From the Signal API record
Signal
Patent grant

What this signalsA new patent often shows where a company is putting its R&D budget.

Grant date
Sep 29, 2026
Inventors
4
Patent number
US12747917
Assignee
BITMAIN TECHNOLOGIES INC.

The full record

From the Signal API record

People

  • Zesen NieInventor
  • Fengjie LiInventor
  • Xiaoxiong ZhangInventor
  • Haidie ChenInventor

Details

Primary CPC class
F28F 3/048
USPTO assignee
BITMAIN TECHNOLOGIES INC.
What the invention does
A layered cooling plate that circulates fluid through connected straight and bent channels to draw heat away from equipment.

Topics and mentions

Tags

  • Intellectual Property
  • Research & Development
  • Engineering
  • Data Center

Technologies named

  • liquid cooling
  • thermal management
  • cooling plates

Extraction

Detected
Sep 30, 2026
signal_type
patents-company
signal_subtype
patentGrant

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This page shows a preview. The full patents-company record in the Signal API and MCP can also have these 8 fields. Some fields are empty for some signals.

Company

  • linkedin_urlValue in the API
  • industriesValue in the API
  • employee_count_lowValue in the API
  • employee_count_highValue in the API
  • revenueValue in the API
  • descriptionValue in the API

Signal

  • signal_nameValue in the API
  • associationValue in the API
Show the full JSONThe record on this page and the API request

GET /v1/signals/e40982b0-a507-5b87-9780-5161372adc92 returns this record as JSON. POST /v1/companies/enrich returns every signal for bitmain.com.

{
  "signal_id": "e40982b0-a507-5b87-9780-5161372adc92",
  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-09-30T17:07:08+00:00",
  "company": {
    "name": "Bitmain",
    "domain": "bitmain.com"
  },
  "data": {
    "cpc": [
      {
        "code": "F28F 3/048"
      }
    ],
    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Engineering",
      "Data Center"
    ],
    "detail": "In September 2026 Bitmain patented a fluid-based cooling solution for managing heat in high-performance computing equipment and electronics.",
    "summary": "Bitmain was granted a patent for a more efficient cooling device",
    "event_at": "2026-09-29",
    "inventors": [
      {
        "name": "Zesen Nie",
        "status": "unresolved",
        "is_primary": true
      },
      {
        "name": "Fengjie Li",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Xiaoxiong Zhang",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/xiaoxiong-zhang"
      },
      {
        "name": "Haidie Chen",
        "status": "unresolved",
        "is_primary": false
      }
    ],
    "event_kind": "grant_date",
    "grant_date": "2026-09-29",
    "source_url": "https://patents.google.com/patent/US12747917",
    "cpc_primary": {
      "code": "F28F 3/048"
    },
    "patent_title": "Cooling device",
    "patent_number": "US12747917",
    "uspto_assignee": "BITMAIN TECHNOLOGIES INC.",
    "patent_abstract": "The present application provides a cooling device. The cooling device includes a first plate body and a second plate body, where a first surface of the first plate body is provided with a flow channel, the flow channel is configured to accommodate fluid, the flow channel includes at least two straight segments and at least one bent segment, the at least two straight segments are communicated via the at least one bent segment, the first surface of the first plate body is in contact with the second plate body. The cooling device of the present application has an enhanced heat dissipation performance.",
    "precision_class": "structural",
    "invention_explanation": "A layered cooling plate that circulates fluid through connected straight and bent channels to draw heat away from equipment.",
    "technologies_mentioned": [
      "liquid cooling",
      "thermal management",
      "cooling plates"
    ]
  }
}

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