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CadenceLIVE Taiwan 2026 is here! π Join us on August 27 in Hsinchu as we power the AI supercycle with "Design for AI and AI for Design" strategies. Discover key innovations including agentic AI in IC design, 3D-IC and chiplets, CPO, and silicon photonics. You'll also hear directly from industry leaders at TSMC, MediaTek, and ITRI as they share their expertise and visionary outlooks in our keynotes. Dive deep into our technical sessions to explore how Cadence solutions deliver proven, real-world results for next-gen designs. Save your spot now: https://lnkd.in/eZeByyUn