Corning Unveils Glass Formula Withstanding 110°C Heat, Escalating the Materials Battle in CPO Co-Packaged Optics
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When the world's computing chips run at full capacity, the instantaneous high temperatures in their peripheral areas are becoming the deadliest killer in advanced packaging. At the recently concluded ECTC 2026 conference, specialty glass and ceramic materials giant Corning dropped a bombshell: a new paper from its R&D team revealed that conventional ion-exchange glass used for optical waveguides degrades sharply after just three months in a 110°C environment. In contrast, Corning's specially formulated CPO packaging glass can operate continuously for five years under the same harsh thermal conditions, with a refractive index change of less than 1.5%. This breakthrough means that in the cutting-edge battlefield of Co-Packaged Optics (CPO), the battle over base material technology has officially moved from the proof-of-concept stage into the deep waters of reliability and mass production capability. Corning's approach is extremely aggressive, attempting to unify optical and electrical signals on a single glass substrate. Specifically, optical waveguides for transmitting light signals are first fabricated inside the glass using an ion-exchange process, followed by the creation of thin-film circuits in etched grooves. The Photonic Integrated Circuit (PIC) is mounted onto the glass substrate via flip-chip bonding using evanescent field coupling, and then connected to the...
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