Intel was granted a patent for a dual-fan add-in card cooler

{
  "signal_id": "00ace44a-e2c0-5d4c-bdbe-62d356218324",
  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-09-30T17:45:19+00:00",
  "company": {
    "name": "Intel",
    "domain": "intel.com"
  },
  "data": {
    "cpc": [
      {
        "code": "H05K 5/0269",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "H05K 5/0213",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "H05K 5/03",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "H05K 7/20154",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "H05K 7/20172",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      }
    ],
    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Engineering",
      "Data Center"
    ],
    "detail": "In September 2026 Intel patented multi-slot expansion-card cooling for servers and other high-performance computing systems.",
    "summary": "Intel was granted a patent for a dual-fan add-in card cooler",
    "event_at": "2026-09-29",
    "inventors": [
      {
        "name": "Jyotiba Suryawanshi",
        "status": "resolved",
        "is_primary": true,
        "linkedin_url": "https://www.linkedin.com/in/jyotibasuryawanshi"
      },
      {
        "name": "John Mathew",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/john-mathew-68898a70"
      },
      {
        "name": "Anudeep Gali",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/anudeep-gali-3a83221b"
      },
      {
        "name": "Jain Raj Vettuvazhy Puthenpurayil",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Ali Kalantarian",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/ali-kalantarian-ph-d-p-eng-46230826"
      }
    ],
    "tech_area": "PCB / electronics packaging",
    "event_kind": "grant_date",
    "grant_date": "2026-09-29",
    "source_url": "https://patents.google.com/patent/US12750963",
    "cpc_primary": {
      "code": "H05K 5/0269",
      "label": "Printed circuits; casings; manufacture of electrical assemblages"
    },
    "patent_title": "Multi slot add-in card with first and second cooling air movers and extended heat sink fins",
    "patent_number": "US12750963",
    "uspto_assignee": "Intel Corporation",
    "patent_abstract": "An apparatus is described. The apparatus includes a multi-slot add-in card having a second air mover stacked with a first air mover. The add-in card has a heat sink. The heat sink has fins. The fins extend into a first path of a first air flow and a second path of a second air flow. The first air mover is to generate the first air flow and the second air mover is to generate the second air flow.",
    "precision_class": "structural",
    "invention_explanation": "An expansion card stacks two fans and extends shared heat-sink fins into both airflow paths to remove heat more effectively.",
    "technologies_mentioned": [
      "add-in cards",
      "thermal management",
      "heat sinks",
      "cooling fans"
    ]
  }
}

curl https://signals.autobound.ai/v1/signals/00ace44a-e2c0-5d4c-bdbe-62d356218324 \
  -H "X-API-KEY: $AUTOBOUND_API_KEY"

curl -X POST https://signals.autobound.ai/v1/companies/enrich \
  -H "X-API-KEY: $AUTOBOUND_API_KEY" \
  -H "Content-Type: application/json" \
  -d '{"domain":"intel.com","limit":20}'