Lam Research was granted a patent for controlling metal contamination in chipmaking.

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  "detected_at": "2026-09-30T17:12:47+00:00",
  "company": {
    "name": "Lam Research",
    "domain": "lamresearch.com"
  },
  "data": {
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    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Manufacturing Operations",
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    "detail": "In September 2026 Lam Research patented cleaning and treatment processes for semiconductor wafers during metal-containing photoresist development.",
    "summary": "Lam Research was granted a patent for controlling metal contamination in chipmaking.",
    "event_at": "2026-09-29",
    "inventors": [
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        "status": "resolved",
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        "name": "Ji Yeon Kim",
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    "grant_date": "2026-09-29",
    "source_url": "https://patents.google.com/patent/US12748352",
    "cpc_primary": {
      "code": "G03F 7/40"
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    "patent_title": "Control of metallic contamination from metal-containing photoresist",
    "patent_number": "US12748352",
    "uspto_assignee": "Lam Research Corporation",
    "patent_abstract": "Various techniques for controlling metal-containing contamination on a semiconductor substrate are provided herein. Such techniques may involve one or more of a post-development bake treatment, a chemical treatment, a plasma treatment, a light treatment, and a backside and bevel edge clean. The techniques may be combined as desired for a particular application. In many cases, the techniques are used to address metal-containing contamination that is generated during a photoresist development operation.",
    "precision_class": "structural",
    "invention_explanation": "A set of bake, chemical, plasma, light, and edge-cleaning steps that removes unwanted metal from wafers after photoresist processing.",
    "technologies_mentioned": [
      "semiconductor processing",
      "photoresist",
      "plasma cleaning",
      "wafer cleaning"
    ]
  }
}

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