Micron was granted a patent for aligning dies in semiconductor assemblies

{
  "signal_id": "17e47cb8-dbdc-5b67-ad09-ff45158f5bfc",
  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-09-30T17:49:14+00:00",
  "company": {
    "name": "Micron",
    "domain": "micron.com"
  },
  "data": {
    "cpc": [
      {
        "code": "H10W 90/00"
      },
      {
        "code": "H10W 46/00"
      },
      {
        "code": "H10W 95/00"
      }
    ],
    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Engineering",
      "Manufacturing Operations"
    ],
    "detail": "In September 2026 Micron patented registration-mark structures for accurately stacking and aligning semiconductor dies in advanced chip packages.",
    "summary": "Micron was granted a patent for aligning dies in semiconductor assemblies",
    "event_at": "2026-09-29",
    "inventors": [
      {
        "name": "Shiro Uchiyama",
        "status": "unresolved",
        "is_primary": true
      }
    ],
    "event_kind": "grant_date",
    "grant_date": "2026-09-29",
    "source_url": "https://patents.google.com/patent/US12751341",
    "cpc_primary": {
      "code": "H10W 90/00"
    },
    "patent_title": "Semiconductor assemblies with system and methods for aligning dies using registration marks",
    "patent_number": "US12751341",
    "uspto_assignee": "Micron Technology, Inc.",
    "patent_abstract": "Semiconductor device assemblies having features that are used to align semiconductor dies, and associated systems and methods, are disclose herein. In some embodiments, a semiconductor device assembly includes substrate that has a top surface and an alignment structure at the top surface. A first die is disposed over the top surface of the substrate, and the first die has a first channel that extends between a top side and a bottom side of the first die. The first channel is vertically aligned with and exposes the alignment structure at the top surface of the substrate.",
    "precision_class": "structural",
    "invention_explanation": "A package design that uses matching marks and channels to line up multiple chip dies during assembly.",
    "technologies_mentioned": [
      "semiconductor packaging",
      "die alignment",
      "registration marks",
      "chip assembly"
    ]
  }
}

curl https://signals.autobound.ai/v1/signals/17e47cb8-dbdc-5b67-ad09-ff45158f5bfc \
  -H "X-API-KEY: $AUTOBOUND_API_KEY"

curl -X POST https://signals.autobound.ai/v1/companies/enrich \
  -H "X-API-KEY: $AUTOBOUND_API_KEY" \
  -H "Content-Type: application/json" \
  -d '{"domain":"micron.com","limit":20}'