US patent US12777574
Coaxial ground shield for improved signal integrity
Abstract
A device includes a printed circuit board (PCB) including a signal trace electrically coupled to a signal via. The device further includes a coaxial ground shield configured to reduce signal interference with respect to the signal via. The coaxial ground shield includes a ground via formed in the PCB substantially surrounding the signal via and substantially coaxial with the signal via. The coaxial ground shield further includes metal plating on a wall of the ground via. The metal plating is electrically coupled to a ground plane of the PCB. The coaxial ground shield further includes resin at least partially filling the ground via.