Skip to main content
NvidiaPatent grant

NVIDIA was granted a patent for coaxial shielding on circuit boards

What happened

In October 2026 NVIDIA patented a PCB design for reducing electrical interference in high-speed computing and electronics hardware.

Source

patents.google.comOct 27, 2026

US patent US12777574

Coaxial ground shield for improved signal integrity

Abstract

A device includes a printed circuit board (PCB) including a signal trace electrically coupled to a signal via. The device further includes a coaxial ground shield configured to reduce signal interference with respect to the signal via. The coaxial ground shield includes a ground via formed in the PCB substantially surrounding the signal via and substantially coaxial with the signal via. The coaxial ground shield further includes metal plating on a wall of the ground via. The metal plating is electrically coupled to a ground plane of the PCB. The coaxial ground shield further includes resin at least partially filling the ground via.

patents.google.com/patent/US12777574Read the full source

Extracted by Autobound

From the Signal API record
Signal
Patent grant

What this signalsA new patent often shows where a company is putting its R&D budget.

Grant date
Oct 27, 2026
Inventors
4
Tech area
PCB / electronics packaging
Patent number
US12777574

The full record

From the Signal API record

People

  • Tibet ZhaoInventor
  • Baal YangInventor
  • Yongwei ChenInventor
  • Jiawei ZengInventor

Details

Primary CPC class
H05K 1/0222 (Printed circuits; casings; manufacture of electrical assemblages)
USPTO assignee
NVIDIA Corporation
What the invention does
A plated ground via surrounds a signal via like a coaxial cable, helping keep unwanted electrical noise away from the signal.

Topics and mentions

Tags

  • Intellectual Property
  • Research & Development
  • Engineering
  • Product Development

Technologies named

  • PCB design
  • signal integrity
  • coaxial shielding
  • electronics packaging

Extraction

Detected
Oct 30, 2026
signal_type
patents-company
signal_subtype
patentGrant

Use this data

Get every patent signal for Nvidia and the companies you sell to, in the tools you already use.

  1. Ask Claude about it

    Connect Autobound to Claude, Claude Code or Cursor with MCP. Then ask: “What changed at Nvidia this week?”

  2. Send it to your own tools

    The Signal API returns patent signals for any list of companies as JSON, for your CRM, warehouse or app.

  3. Try it free

    Sign up and spend your free credits on the companies you sell to.

    Start Free1,000 free credits

The API returns more than this page shows

This page shows a preview. The full patents-company record in the Signal API and MCP can also have these 8 fields. Some fields are empty for some signals.

Company

  • linkedin_urlValue in the API
  • industriesValue in the API
  • employee_count_lowValue in the API
  • employee_count_highValue in the API
  • revenueValue in the API
  • descriptionValue in the API

Signal

  • signal_nameValue in the API
  • associationValue in the API
Show the full JSONThe record on this page and the API request

GET /v1/signals/1bcb4b3f-2e65-5ad4-98af-c35ff0aa258b returns this record as JSON. POST /v1/companies/enrich returns every signal for nvidia.com.

{
  "signal_id": "1bcb4b3f-2e65-5ad4-98af-c35ff0aa258b",
  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-10-30T01:05:22+00:00",
  "company": {
    "name": "Nvidia",
    "domain": "nvidia.com"
  },
  "data": {
    "cpc": [
      {
        "code": "H05K 1/0222",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "H05K 1/113",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "H05K 3/0047",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "H05K 3/0094",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "H05K 3/429",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      }
    ],
    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Engineering",
      "Product Development"
    ],
    "detail": "In October 2026 NVIDIA patented a PCB design for reducing electrical interference in high-speed computing and electronics hardware.",
    "summary": "NVIDIA was granted a patent for coaxial shielding on circuit boards",
    "event_at": "2026-10-27",
    "inventors": [
      {
        "name": "Tibet Zhao",
        "status": "resolved",
        "is_primary": true,
        "linkedin_url": "https://www.linkedin.com/in/tibet-zhao-b2990888"
      },
      {
        "name": "Baal Yang",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/baal-yang-82b285236"
      },
      {
        "name": "Yongwei Chen",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Jiawei Zeng",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/jiawei-zeng-aa32b2216"
      }
    ],
    "tech_area": "PCB / electronics packaging",
    "event_kind": "grant_date",
    "grant_date": "2026-10-27",
    "source_url": "https://patents.google.com/patent/US12777574",
    "cpc_primary": {
      "code": "H05K 1/0222",
      "label": "Printed circuits; casings; manufacture of electrical assemblages"
    },
    "patent_title": "Coaxial ground shield for improved signal integrity",
    "patent_number": "US12777574",
    "uspto_assignee": "NVIDIA Corporation",
    "patent_abstract": "A device includes a printed circuit board (PCB) including a signal trace electrically coupled to a signal via. The device further includes a coaxial ground shield configured to reduce signal interference with respect to the signal via. The coaxial ground shield includes a ground via formed in the PCB substantially surrounding the signal via and substantially coaxial with the signal via. The coaxial ground shield further includes metal plating on a wall of the ground via. The metal plating is electrically coupled to a ground plane of the PCB. The coaxial ground shield further includes resin at least partially filling the ground via.",
    "precision_class": "structural",
    "invention_explanation": "A plated ground via surrounds a signal via like a coaxial cable, helping keep unwanted electrical noise away from the signal.",
    "technologies_mentioned": [
      "PCB design",
      "signal integrity",
      "coaxial shielding",
      "electronics packaging"
    ]
  }
}

Long text fields are shortened on this page.

Looking up one signal by its id is free. Enrich costs 2 credits per signal returned; a call with no results is free.