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High Bandwidth Flash Advances At The 2026 FMS Conference

What happened

Sandisk showcased its 218-layer BiCS8 eSSDs, available in a compute version with TLC NAND up to 32TB and a storage version with QLC NAND up to 256TB.

Source

forbes.comAug 21, 2026By Thomas Coughlin, Contributor

High Bandwidth Flash Advances At The 2026 FMS Conference

Article excerpt

By Thomas Coughlin, Contributor. At the 2026 FMS Conference, SK hynix and Sandisk unveiled significant advancements in memory and storage, particularly focusing on High Bandwidth Flash (HBF) for AI inference. SK hynix introduced new memory tiers like G0.5 (3D-stacked DRAM), G1.5 (HBF), and G2.5 (CXL-pooled memory) to optimize xPU performance. Sandisk showcased its BiCS8 and BiCS10 NAND technologies and highlighted HBF's potential to provide high-capacity, high-performance non-volatile storage, supplementing or replacing HBM. The first HBF specification was released, detailing capacities up to 512GB and bandwidths from 0.4TB/s to 3.0TB/s, utilizing UCIe interconnect. HBF demonstrated 2X GPU efficiency in AI inference compared to HBM, signaling a major shift in AI memory solutions. At the 2026 FMS Conference in Santa Clara California, stacking DRAM and NAND flash chips and making semi-customized products that expand the storage/memory hierarchy was a major topic. This piece will focus on the efforts to create high bandwidth flash, HBF, to support AI inference applications. SK hynix partnered with Sandisk to develop HBF, starting in early 2025 We will show SK hynix FMS material first, including their NAND and DRAM advances, as well as HBF and then show Sandisk presentation materials on their NAND products and HBF. During the SK hynix keynote, Kang Uksong, VP and Head of Next...

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Extracted from this sentence

He also showed Sandisk 218-layer BiCS8 eSSDs for compute and storage, shown below.

Extracted by Autobound

From the Signal API record
Event
Launch

What this signalsA launch often needs new go-to-market and support spend.

Product
BiCS8

The full record

From the Signal API record

Topics and mentions

Product tags

  • general technology

Extraction

Confidence
90%
Detected
Aug 21, 2026
signal_type
news
signal_subtype
launches

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This page shows a preview. The full news record in the Signal API and MCP can also have these 8 fields. Some fields are empty for some signals.

Company

  • linkedin_urlValue in the API
  • industriesValue in the API
  • employee_count_lowValue in the API
  • employee_count_highValue in the API
  • revenueValue in the API
  • descriptionValue in the API

Signal

  • signal_nameValue in the API
  • associationValue in the API
Show the full JSONThe record on this page and the API request

GET /v1/signals/143bc9d2-5c1d-6aa2-f555-5e8d03d49ecc returns this record as JSON. POST /v1/companies/enrich returns every signal for sandisk.com.

{
  "signal_id": "143bc9d2-5c1d-6aa2-f555-5e8d03d49ecc",
  "signal_type": "news",
  "signal_subtype": "launches",
  "detected_at": "2026-08-21T04:07:11+00:00",
  "company": {
    "name": "Sandisk",
    "domain": "sandisk.com"
  },
  "data": {
    "url": "https://www.forbes.com/sites/tomcoughlin/2026/08/21/high-bandwidth-flash-advances-at-the-2026-fms-conference/",
    "title": "High Bandwidth Flash Advances At The 2026 FMS Conference",
    "author": "Thomas Coughlin, Contributor",
    "excerpt": "By Thomas Coughlin , Contributor. At the 2026 FMS Conference, SK hynix and Sandisk unveiled significant advancements in memory and storage, particularly focusing on High Bandwidth Flash (HBF) for AI inference. SK hynix introduced new memory tiers like G0.5 (3D-stacked DRAM), G1.5 (HBF), and G2.5 (CXL-pooled memory) to optimize xPU performance. Sandisk showcased its BiCS8 and BiCS10 NAND technologies and highlighted HBF's potential to provide high-capacity, high-performance non-volatile storage, supplementing or replacing HBM. The first HBF specification was released, detailing capacities up to 512GB and bandwidths from 0.4TB/s to 3.0TB/s, utilizing UCIe interconnect. HBF demonstrated 2X GPU efficiency in AI inference compared to HBM, signaling a major shift in AI memory solutions. At the 2026 FMS Conference in Santa Clara California, stacking DRAM and NAND flash chips and making semi-customized products that expand the storage/memory hierarchy was a major topic. This piece will focus on the efforts to create high bandwidth flash, HBF, to support AI inference applications. SK hynix partnered with Sandisk to develop HBF, starting in early 2025 We will show SK hynix FMS material first, including their NAND and DRAM advances, as well as HBF and then show Sandisk presentation materials on their NAND products and HBF. During the SK hynix keynote, Kang Uksong, VP and Head of Next...",
    "product": "BiCS8 eSSDs",
    "summary": "Sandisk showcased its 218-layer BiCS8 eSSDs, available in a compute version with TLC NAND up to 32TB and a storage version with QLC NAND up to 256TB.",
    "planning": false,
    "image_url": "https://imageio.forbes.com/specials-images/imageserve/6a87ca910e6bb9c29709afae/0x0.jpg?format=jpg&height=900&width=1600&fit=bounds",
    "confidence": 0.9,
    "product_data": {
      "name": "BiCS8",
      "full_text": "Sandisk 218-layer BiCS8 eSSDs",
      "fuzzy_match": false
    },
    "product_tags": [
      "general_technology"
    ],
    "published_at": "2026-08-21T04:07:11Z",
    "article_sentence": "He also showed Sandisk 218-layer BiCS8 eSSDs for compute and storage, shown below."
  }
}

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