Supermicro Expands Its End-to-End DCBBS Liquid Cooling Portfolio with Rear Door Heat Exchangers for High-Density AI and HPC Infrastructure
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SAN JOSE, California, July 16, 2026 /PRNewswire/ -- Super Micro Computer, Inc. (NASDAQ: SMCI), a leading provider of complete IT solutions for AI, enterprise, storage, and 5G/Edge with Data Center Building Block Solutions® (DCBBS), today announced the expansion of its portfolio with Rear Door Heat Exchangers (RDHx), further strengthening its end-to-end liquid cooling solutions for high-density AI and HPC infrastructure. As a key component of DCBBS, the expanded RDHx portfolio offers flexible cooling capacities, allowing data center administrators to easily implement liquid cooling in both new and existing data centers. "We continue to expand our DCBBS offerings to provide our customers with unparalleled customization and optimization capabilities," said Charles Liang, president and CEO of Supermicro. "Our expanded RDHx portfolio helps customers optimally benefit from liquid cooling. The solutions offer a cooling capacity of 10 kW to 120 kW at the door level and up to a maximum of 240 kW per rack, enabling data centers to operate more efficiently." Learn more about Supermicro's RDHx portfolio here and watch this video summary. Customers can design and implement validated rack-scale cooling solutions tailored to their specific data center requirements, infrastructure limitations, and workload demands, leading to higher compute density, improved cooling efficiency, and lower...
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