Teradyne introduces integrated test solution for AI and data center devices in collaboration with Tokyo Electron.
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Teradyne introduces integrated test solution for AI and data center devices in collaboration with Tokyo Electron. Teradyne's UltraFLEXplus platform paired with Tokyo Electron's probing technology delivers known good device screening for advanced 2.5D/3D packages. NORTH READING, Mass. / Jun 08, 2026 / Business Wire / Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced an integrated test cell solution supporting known good device (KGD) screening for devices used in AI and data center applications, developed in collaboration with Tokyo Electron (TEL(TM). The solution pairs Teradyne's UltraFLEXplus platform with TEL's Prexa(TM) SDP (Singulated Device Prober) to provide fabless designers, foundries, and OSATs a production-ready path to high-quality device screening at multiple points in the advanced packaging flow. As AI and data center device architectures increasingly adopt chiplet-based designs that integrate multiple die into a single 2.5D or 3D package, a single defective die can compromise the entire high-value package. Adding KGD screening is essential to protecting final yield, improving quality, and maximizing output. The joint solution between Teradyne and TEL delivers a validated test cell designed to reduce integration risk for high-volume manufacturing. Within the test cell, Teradyne's UltraFLEXplus...
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