Applied Materials was granted a patent for a wafer-processing power splitter.

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  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-09-30T17:29:49+00:00",
  "company": {
    "name": "Applied Materials",
    "domain": "appliedmaterials.com"
  },
  "data": {
    "cpc": [
      {
        "code": "H01J 37/32183"
      },
      {
        "code": "H01J 2237/3321"
      },
      {
        "code": "H01J 2237/3387"
      }
    ],
    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Manufacturing Operations",
      "Engineering"
    ],
    "detail": "In September 2026 Applied Materials patented RF power-distribution technology for semiconductor fabrication equipment serving multiple wafer-processing chambers.",
    "summary": "Applied Materials was granted a patent for a wafer-processing power splitter.",
    "event_at": "2026-09-29",
    "inventors": [
      {
        "name": "Edward P. Hammond, IV",
        "status": "unresolved",
        "is_primary": true
      },
      {
        "name": "David Coumou",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Upendra Ummethala",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/upendra-ummethala-ba7726"
      }
    ],
    "event_kind": "grant_date",
    "grant_date": "2026-09-29",
    "source_url": "https://patents.google.com/patent/US12749655",
    "cpc_primary": {
      "code": "H01J 37/32183"
    },
    "patent_title": "Splitter circuit for wafer processing system",
    "patent_number": "US12749655",
    "uspto_assignee": "Applied Materials, Inc.",
    "patent_abstract": "The present disclosure describes a semiconductor wafer processing system that uses a splitter circuit to delivery RF power from a power supply to multiple process chambers. The wafer processing system includes a first process chamber, a second process chamber, a power supply, a match circuit, and a splitter circuit. The power supply produces an electric current. The match circuit receives the electric current from the power supply and presents an impedance to the power supply. The splitting circuit includes a first leg and a second leg. The first leg includes a first capacitor that directs a first portion of the electric current from the match circuit to the first process chamber. The second leg includes a second capacitor that directs a second portion of the electric current from the match circuit to the second process chamber.",
    "precision_class": "structural",
    "invention_explanation": "A circuit that divides radio-frequency power from one supply between several processing chambers while matching the electrical load for stable operation.",
    "technologies_mentioned": [
      "semiconductor processing",
      "RF power distribution",
      "wafer fabrication equipment"
    ]
  }
}

curl https://signals.autobound.ai/v1/signals/2cd4830e-01ef-519f-972a-4bf308dedf26 \
  -H "X-API-KEY: $AUTOBOUND_API_KEY"

curl -X POST https://signals.autobound.ai/v1/companies/enrich \
  -H "X-API-KEY: $AUTOBOUND_API_KEY" \
  -H "Content-Type: application/json" \
  -d '{"domain":"appliedmaterials.com","limit":20}'