Applied Materials was granted a patent for multi-target chip-process analysis.

{
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  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-09-30T17:48:17+00:00",
  "company": {
    "name": "Applied Materials",
    "domain": "appliedmaterials.com"
  },
  "data": {
    "cpc": [
      {
        "code": "H10P 72/0612"
      },
      {
        "code": "G01B 11/00"
      },
      {
        "code": "G05B 19/41875"
      },
      {
        "code": "G01B 2210/56"
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    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Manufacturing Operations",
      "Quality Assurance"
    ],
    "detail": "In September 2026 Applied Materials patented in-chamber measurement technology for monitoring semiconductor fabrication across differently shaped test features during processing.",
    "summary": "Applied Materials was granted a patent for multi-target chip-process analysis.",
    "event_at": "2026-09-29",
    "inventors": [
      {
        "name": "Yudong Hao",
        "status": "resolved",
        "is_primary": true,
        "linkedin_url": "https://www.linkedin.com/in/yudong-hao-9a520911"
      },
      {
        "name": "Todd J. Egan",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/todd-egan-009571"
      }
    ],
    "event_kind": "grant_date",
    "grant_date": "2026-09-29",
    "source_url": "https://patents.google.com/patent/US12751240",
    "cpc_primary": {
      "code": "H10P 72/0612"
    },
    "patent_title": "Multi-target design for in-situ analysis of semiconductor fabrication process",
    "patent_number": "US12751240",
    "uspto_assignee": "Applied Materials",
    "patent_abstract": "A system can provide in-situ analysis of at least some of a plurality of targets simultaneously during a fabrication process. The system can include a semiconductor processing tool having a chamber. The system can also include a sample arranged within the chamber, the sample having the plurality of targets with different feature orientations and/or feature geometries. The semiconductor processing tool can be configured to perform the fabrication process on the sample. Additionally, the system can include a metrology tool integrated with the semiconductor processing tool. The metrology tool can provide the in-situ analysis of at least some of the plurality of targets simultaneously during the fabrication process.",
    "precision_class": "structural",
    "invention_explanation": "A setup that places multiple differently shaped test targets inside a processing chamber so several aspects of chip fabrication can be measured at once.",
    "technologies_mentioned": [
      "semiconductor fabrication",
      "in-situ metrology",
      "process monitoring",
      "feature geometry"
    ]
  }
}

curl https://signals.autobound.ai/v1/signals/20d35cfd-bb38-54fe-82e3-8391eedfb080 \
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curl -X POST https://signals.autobound.ai/v1/companies/enrich \
  -H "X-API-KEY: $AUTOBOUND_API_KEY" \
  -H "Content-Type: application/json" \
  -d '{"domain":"appliedmaterials.com","limit":20}'