At Hot Chips 2026, d-Matrix announced an AI accelerator architecture stacked directly on custom DRAM delivering 100 TB/s per card, utilizing a TSMC 4nm compute die bonded face-to-face at a 36-micron pitch.
r/NewMaxx
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TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die
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{
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"signal_type": "reddit-company",
"signal_subtype": "productLaunch",
"detected_at": "2026-08-26T16:31:41+00:00",
"company": {
"name": "d-Matrix",
"domain": "d-matrix.ai"
},
"data": {
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"topics": [
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"summary": "At Hot Chips 2026, d-Matrix announced an AI accelerator architecture stacked directly on custom DRAM delivering 100 TB/s per card, utilizing a TSMC 4nm compute die bonded face-to-face at a 36-micron pitch.",
"evidence": [
"[post] Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card - TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die",
"[post] TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die"
],
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"virality": "very_low",
"post_date": "2026-08-26T16:31:41.000Z",
"post_kind": "link",
"sentiment": "positive",
"subreddit": "NewMaxx",
"event_date": "2026-08",
"post_flair": [
"Event"
],
"post_title": "Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card - TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die",
"prominence": "core",
"source_url": "https://www.reddit.com/r/NewMaxx/comments/1vz22lh/hot_chips_2026_dmatrix_stacks_ai_accelerator/",
"entity_role": "subject",
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"event_date_text": "Hot Chips 2026",
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"products_mentioned": [
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}
curl https://signals.autobound.ai/v1/signals/c5d74802-fe3e-5b78-a0e3-756e12641dc4 \
-H "X-API-KEY: $AUTOBOUND_API_KEY"curl -X POST https://signals.autobound.ai/v1/companies/enrich \
-H "X-API-KEY: $AUTOBOUND_API_KEY" \
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