Intel Foundry deepens partnership with ASML to advance High-NA EUV for larger AI chips
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TradingKey – Intel's ( INTC ) foundry business further deepens its High-NA EUV partnership with ASML ( ASML ). ASML recently announced it is collaborating with leading chip manufacturers such as Intel, Nvidia ( NVDA ), TSMC ( TSM ), and Samsung Electronics to develop larger photomasks, thereby advancing next-generation High-NA EUV systems for manufacturing large AI and data center chips. Currently, ASML's widely used EUV lithography systems can produce large chips with an area of approximately 800 square millimeters, and high-end data center processors from companies like Nvidia are already approaching this size limit. Although the new generation High-NA EUV technology enables more precise chip manufacturing, it is currently limited by smaller photomask sizes, which makes direct production of chips with the same area as current large AI chips difficult. To solve this problem, ASML plans to develop larger photomask technologies so that High-NA EUV can manufacture large data center chips in the future. Marco Pieters, Chief Technology Officer of ASML, stated that if this technology upgrade is successfully implemented in the industry, the production efficiency of High-NA EUV systems is expected to increase by approximately 40%. The company plans to demonstrate a pilot production line around 2031 and make the technology ready for mass production by 2033.Intel is among the chip...
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