Micron was granted a patent for advanced 3D memory-device architecture.

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  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-09-30T17:46:03+00:00",
  "company": {
    "name": "Micron",
    "domain": "micron.com"
  },
  "data": {
    "cpc": [
      {
        "code": "H10B 43/27"
      },
      {
        "code": "H10B 41/27"
      }
    ],
    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Consumer Technology",
      "Engineering"
    ],
    "detail": "In September 2026 Micron patented vertically stacked memory technology for high-density storage in electronic systems such as computing and consumer devices.",
    "summary": "Micron was granted a patent for advanced 3D memory-device architecture.",
    "event_at": "2026-09-29",
    "inventors": [
      {
        "name": "Yoshiaki Fukuzumi",
        "status": "unresolved",
        "is_primary": true
      },
      {
        "name": "Jun Fujiki",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Matthew J. King",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/matt-king-13961511"
      },
      {
        "name": "Sidhartha Gupta",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Paolo Tessariol",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/paolo-tessariol-0816a080"
      },
      {
        "name": "Kunal Shrotri",
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        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/kunalshrotri"
      },
      {
        "name": "Kye Hyun Baek",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Kyle A. Ritter",
        "status": "unresolved",
        "is_primary": false
      }
    ],
    "event_kind": "grant_date",
    "grant_date": "2026-09-29",
    "source_url": "https://patents.google.com/patent/US12751012",
    "cpc_primary": {
      "code": "H10B 43/27"
    },
    "patent_title": "Memory devices and related electronic systems",
    "patent_number": "US12751012",
    "uspto_assignee": "Micron Technology, Inc.",
    "patent_abstract": "A microelectronic device comprises a stack structure comprising a stack structure comprising a vertically alternating sequence of conductive structures and insulative structures arranged in tiers, the stack structure divided into block structures separated from one another by slot structures, strings of memory cells vertically extending through the block structures of the stack structure, the strings of memory cells individually comprising a channel material vertically extending through the stack structure, an additional stack structure vertically overlying the stack structure and comprising a vertical sequence of additional conductive structures and additional insulative structures arranged in additional tiers, first pillars extending through the additional stack structure and vertically overlying the strings of memory cells, each of the first pillars horizontally offset from a center of a corresponding string of memory cells, second pillars extending through the additional stack structure and vertically overlying the strings of memory cells, and additional slot structures comprising a dielectric material extending through at least a portion of the additional stack structure and sub-dividing each of the block structures into sub-block structures, the additional slot structures horizontally neighboring the first pillars. Related microelectronic devices, electronic systems, and...",
    "precision_class": "structural",
    "invention_explanation": "A layered memory structure stacks conductive and insulating tiers, with vertical columns of memory cells divided into separate blocks to pack more storage into a small area.",
    "technologies_mentioned": [
      "3D NAND memory",
      "vertical memory cells",
      "microelectronic devices"
    ]
  }
}

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curl -X POST https://signals.autobound.ai/v1/companies/enrich \
  -H "X-API-KEY: $AUTOBOUND_API_KEY" \
  -H "Content-Type: application/json" \
  -d '{"domain":"micron.com","limit":20}'