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AI-driven compute demand is accelerating the shift to multi-die architectures, bringing new challenges in thermal, power, and mechanical analysis. ⏩ Leaders from AMD, Broadcom, TSMC, and Synopsys discuss why multiphysics analysis is moving earlier in the design process, how co-design workflows are replacing traditional handoffs, and the growing role of AI-driven exploration and digital twins. Dive in: https://bit.ly/45Yqc5q