TSMC develops EMIB-like packaging to retain AI chip orders amid CoWoS strain - CHOSUNBIZ

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  "signal_type": "news",
  "signal_subtype": "expands_facilities",
  "detected_at": "2026-08-03T06:00:00+00:00",
  "company": {
    "name": "TSMC",
    "domain": "tsmc.com"
  },
  "data": {
    "url": "https://biz.chosun.com/en/en-it/2026/08/03/VC5LOPW5HNCURDVUAH6XKXZ5CE/?outputType=amp",
    "title": "TSMC develops EMIB-like packaging to retain AI chip orders amid CoWoS strain - CHOSUNBIZ - Chosunbiz",
    "assets": "advanced process and packaging plants",
    "excerpt": "Taiwanese foundry (contract chip manufacturing) company TSMC is reportedly moving to develop an advanced packaging technology similar to Intel's Embedded Multi-die Interconnect Bridge (EMIB). With demand for artificial intelligence (AI) chips surging and the existing CoWoS packaging technology unable to keep up with customer orders, the move is seen as an effort to prevent orders from shifting to Intel. On the 3rd, Taiwanese outlets including the United Daily News and the Liberty Times reported, citing industry sources, that TSMC is developing a new packaging architecture with Taiwanese substrate maker Kinsus Interconnect Technology. Kinsus is said to be supporting the work of converting the technology from the research and development stage into a mass-producible structure. Kinsus is a manufacturer of integrated circuit (IC) substrates for high-performance chips. It participates in the CoWoS supply chain for Nvidia and TSMC and is also known to supply substrates to AMD and Micron. CoWoS is a technology that places a graphics processing unit (GPU) or AI accelerator and high-bandwidth memory (HBM) on an interposer, a mid-layer connection plate, and then couples them with the package substrate. It can shorten data travel distances between multiple chips to improve processing speed and power efficiency, but as package size grows, interposer fabrication and assembly become more...",
    "summary": "TSMC plans to build 13 advanced process and packaging plants in Taiwan over the next several years as part of its capacity expansion.",
    "location": "Taiwan",
    "planning": true,
    "image_url": "https://biz.chosun.com/resizer/v2/GQRS3QCNYRKIHMY2UD62R5OPME.jpg?auth=6702d15a11d6b9b870f6f1e636a4fbef032f3ad391f84379acac606e3ee5271a&width=1200&height=630&smart=true",
    "confidence": 0.9,
    "assets_tags": [
      "production"
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    "published_at": "2026-08-03T06:00:00Z",
    "location_data": [
      {
        "region": "Eastern Asia",
        "country": "Taiwan",
        "continent": "Asia",
        "fuzzy_match": false
      }
    ],
    "article_sentence": "In Taiwan, it plans to build 13 advanced process and packaging plants over the next several years."
  }
}

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curl -X POST https://signals.autobound.ai/v1/companies/enrich \
  -H "X-API-KEY: $AUTOBOUND_API_KEY" \
  -H "Content-Type: application/json" \
  -d '{"domain":"tsmc.com","limit":20}'