"Taiwan's TSMC succeeds in developing 1.6-nanometer chips, mass production to begin in the fourth quarter this year" - 매일경제
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Taiwan Semiconductor Manufacturing Company Limited (TSMC), the world's largest contract chipmaker, has reportedly succeeded in developing a 1.6-nanometer process chip. Taiwanese media, including Liberty Times, reported on the 20th, citing sources, that TSMC had successfully developed and completed verification of its angstrom-scale A16 (1.6-nanometer) process, which adopts Super Power Rail (SPR), the industry's leading wafer backside power delivery network (BSPDN) technology. The source explained that through SPR, TSMC places the power delivery network on the backside of the wafer rather than the front side, and supplies power directly to the source and drain regions of each transistor through Vertical Backside Contacts (VB). This, the source added, eliminates bottlenecks between signal wiring and power wiring, allowing the company to maximize power efficiency and performance. TSMC was also said to have minimized changes to the front-side gate structure, device size and layout area of the wafer, preserving compatibility with existing wafer designs. Another source said that A16 is suitable for artificial intelligence (AI) and high-performance computing (HPC), and is scheduled to enter mass production in the fourth quarter of this year. The source said A16 is 8% to 10% faster than TSMC's N2P, an enhanced version of its 2-nanometer process, while reducing power consumption by...
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